Best Filtration Membrane, Track Etch Membrane, Nuclear Pore Membrane Applications in Semiconductor W

Grinding and polishing are very important processes in semiconductor and wafer manufacturing. The quality of the abrasive in this process determines the polishing effect of the wafer surface. The ideal result is that the workpiece surface just reaches the thickness that needs to be removed. If the particle size of the abrasive is equal to the thickness of the removed layer, the abrasive particles only need a small mechanical force, and at the same time, the polishing surface defects will be greatly reduced or avoided. The particle size of the abrasive can affect the pressure of the abrasive particles and the depth of the cutting into the workpiece. Generally speaking, in the polishing process, the abrasive particles with large particle size have strong pressure, strong mechanical removal effect, and high material removal rate. Therefore, abrasive particles with larger particle size are prone to produce larger residual scratches or even residual cracks on the polished surface; while abrasive particles with smaller particle size can obtain better polished surface quality.

It can be seen from the above analysis that the balance of the abrasive particle size is an important factor to ensure the polishing effect of the wafer. The abrasive must be strictly filtered before and during use. Does the filtered abrasive fully meet the basic requirements of polishing? Track etching membrane (nuclear pore membrane) is recommended here.
The micropores of the track-etched membrane ensure the uniformity of the pore size by a controllable processing method, so as to complete the precise filtration. In the case of using a cylindrical filtration pore size, the filtration of particles tends to be perfect, and 0.1-0.5um abrasive is used here. Examples of specifications:

The advantages of cylindrical filter holes in filtration
The shape of the membrane pores used by the abrasive has the greatest impact on the filtration effect. The shape of the abrasive before use is mostly irregular polyhedron, and the shape of the circulating slurry is mostly spherical or pebbled (because of wear). Therefore, the irregularity of cellulose materials The filter membrane with pores, or polygonal pores, has inaccurate filtration accuracy, while the circular pores of the track-etched membrane have the highest accuracy among all filter media.

Similarly, irregular or cone-shaped channels are easy to block, affecting filtration accuracy and poor backwashing effect, while cylindrical-shaped channels can effectively overcome this defect. Since the particle size of the abrasive will become smaller with the continuous grinding and polishing, the track etching membrane can be used for the second filtration to ensure the standard degree of the particles.
In short, in the process of grinding and polishing semiconductor wafers, etc., the use of track-etched membranes for abrasive filtration is the most suitable, and by far, the most accurate and filterable membrane material.